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R7KA8M2AFECAC Scheda tecnica(PDF) 9 Page - Renesas Technology Corp |
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R7KA8M2AFECAC Scheda tecnica(HTML) 9 Page - Renesas Technology Corp |
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9 / 295 page  # B A 0 R 7 K A 8 M 2 A D L C AB Package type AB: LFBGA 224 pins AC: LFBGA 289 pins AJ: LFBGA 303 pins AM: LFBGA 169 pins HC: HLQFP 176 pins Quality Grade C: Standard Product S: SiP Product Operating junction temperature L: 0°C to 95°C D: -40°C to 105°C E: -40°C to 125°C Code MRAM and Flash size D: 512 KB (MRAM) F: 1 MB (MRAM) R: 5 MB (MRAM 1 MB + Flash 4 MB) S: 9 MB (MRAM 1 MB + Flash 8 MB) Feature set A: Single Core (CM85 only) J: Dual Core Group number Application RA family K: MRAM (Standard Product) J: MRAM and Flash (SiP Product) Renesas microcontroller Terminal material (Pb-free) A: Sn (Tin) only C: others Production identification code 0: Chip version A 1: Chip version B Performance Packing A: Tray (Bulk) B: Tray (Full carton) U: Tray (Full tray) H: Tape & Reel Figure 1.2 Part numbering scheme RA8M2 Datasheet 1. Overview R01DS0438EJ0130 Rev.1.30 Feb 27, 2026 Page 9 of 295 |
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