194

RoHS Compliant, ELV Compliant

10

Notes:

: Hold current: maximum current device will pass without interruption in 20°C still air.

: Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air.

to assist equipment in meeting the appropriate ITU, UL60950, or GR1089 industry requirements.

: Maximum fault current device can withstand without damage at rated operating voltage. This current is used for component recognition under UL1434.

Devices have been designed to trip safely under higher level power cross conditions to assist equipment in meeting the appropriate ITU, UL60950, or GR1089

industry requirements.

: Power dissipated from device when in the tripped state in 20°C still air.

: Minimum resistance of device as supplied at 20°C unless otherwise specified.

: Maximum resistance of device as supplied at 20°C unless otherwise specified.

: Maximum resistance measured one hour post-trip or post-reflow at 20°C.

*

†

TS600/TSM600

TS600-170F

0.170

0.400

60

600

3.0

2.5

1.0

10.0

4.0

9.0

18.0

TS600-200F-RA-B-0.5 0.200

0.400

60

600

3.0

2.5

1.0

12.0

4.0

7.5

13.5

TS600-400F

0.400

1.000

60

600

3.0

2.0

3.0

5.0

0.5

1.5

2.0

TSM600-250F

0.250

0.860

250

600

3.0

2.0

3.0

0.8

1.0

3.5

7.0

TSM600-250F-RA

0.250

0.860

250

600

3.0

2.0

3.0

1.0

1.0

3.0

5.0

TSM600-400F

0.400

1.000

250

600

3.0

2.0

3.0

5.0

0.5

1.5

2.0

Part

Number

(A)

(A)

(W)

Typical Time-to-trip

(A)

(s)

(

Ω)

(

Ω)

(

Ω)

Operating

Interrupt

Interrupt

(A)

Warning :

• Users should independently evaluate the suitability of and test each product selected for their own application.

• Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.

• These devices are intended for protection against damage caused by occasional overcurrent or overtemperature fault conditions and should

not be used when repeated fault conditions or prolonged trip events are anticipated.

• Contamination of the PPTC material with certain silicone-based oils or some aggressive solvents can adversely impact the performance of the devices.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and

mechanical procedures for electronic components.

• PPTC devices are not recommended for installation in applications where the device is constrained such that its PTC properties are inhibited,

for example in rigid potting materials or in rigid housings, which lack adequate clearance to accommodate device expansion.

• Operation in circuits with a large inductance can generate a circuit voltage (Ldi/dt) above the rated voltage of the device.

C

B

D

A

E

L

C

L

Figure T2

C

B

D

A

E

L

C

L

Figure T3

B

A

C

Figure T4

Table T3 Electrical Characteristics for Telecommunications and Networking Devices

Cont’d

Figure T2-T13 Dimension Figures for Telecommunications and Networking Devices