203

RoHS Compliant, ELV Compliant

10

Dimension

Description

EIA Mark

IEC Mark

Dimension (mm)

Tolerance

Carrier tape width

WW

18

-0.5/+1.0

Hold down tape width

5

Minimum

Top distance between tape edges

3

Maximum

Sprocket hole position

9

-0.5/+0.75

Sprocket hole diameter

4

±0.2

Abcissa to plane (straight lead)

HH

18.5

±3.0

Abcissa to plane (kinked lead)*

16

-0.5/+0.6

Abcissa to top

32.2

Maximum

Overall width with lead protrusion

43.2

Maximum

Overall width without lead protrusion

42.5

Maximum

Lead protrusion

1.0

Maximum

Protrusion of cut-out

LL

11

Maximum

Protrusion beyond hold down tape

Not specified

—

Sprocket hole pitch

12.7

±0.3

Device pitch (TRF250 & TRF600-150)

——

12.7

—

Device pitch (TRF600-160/400)

——

25.4

—

Pitch tolerance

——

20 consecutive

±1

Tape thickness

tt

0.9

Maximum

Tape thickness with splice*

—

2.0

Maximum

Splice sprocket hole alignment

——

0

±0.3

Body lateral deviation

h

h0

±1.0

Body tape plane deviation

p

p0

±1.3

Lead spacing plane deviation

0

±0.7

Lead spacing*

FF

5.08

±0.6

Reel width

w

56

Maximum

Reel diameter

ad

370

Maximum

Space between flanges less device

—

4.75

±3.25

Arbor hole diameter

cf

26

±12.0

Core diameter

nh

80

Maximum

Box

——

56/372/372

Maximum

Consecutive missing pieces*

——

3 maximum

—

Empty places per reel*

——

Not specified

—

* Differs from EIA specification.

TRF250/TRF600 devices are available in tape and reel packaging per EIA 468-B standard. See Figures T23 and T24 for details.

Table T8

TRF250/TRF600 Tape and Reel Specifications for

Telecommunications and Networking Device

Wave Soldering and Rework Recommendations for Telecommunications Radial-leaded Devices

Recommended Wave Soldering

• Soldering temperature profile

Temperature characteristic at component terminal with dual

wave soldering

Rework

• If a device is removed from the board, it should be discarded

and replaced with a new device.

300

250

200

150

100

50

0

0

50

10s

245˚C ... 260˚C

100˚C ... 130˚C

Forced cooling

100150200

250

Time (s)

Figure T22