RoHS compliant, ELV compliant

202

10

Solder Reflow and Rework Recommendations for Telecommunications Surface-mount Devices

Solder Reflow

• Recommended reflow method: IR, vapor phase oven, hot air oven.

• Surface-mount devices are not designed to be wave soldered to the bottom side of the board.

• Recommended maximum paste thickness of 0.25mm (0.010 in).

• Devices can be cleaned using standard industry methods and solvents.

Rework

• If a device is removed from the board, it should be discarded and replaced with a new device.

Profile Feature

Pb-Free Assembly

3°C/second max.

Preheat

150°C

200°C

60-180 seconds

Time maintained above:

217°C

60-150 seconds

Peak/Classification temperature (Tp)

260°C

Time within 5°C of actual peak temperature

Time (tp)

20-40 seconds

Ramp down rate

6°C/second max.

Time 25°C to peak temperature

8 minutes max.

Critical Zone

T

Ramp up

t 25˚C to Peak

Reflow Profile

Time

Ramp down

ts

Preheat

Ts

MAX

T

L

Tp

tp

25

Ts

MIN

t

L

Figure T21

Note: All temperatures refer to topside of the package, measured on the package

body surface.

Agency Recognition for Telecommunications and Networking Devices

UL

File # E74889

CSA

File #78165C

TÜV

Per IEC60730-1

Certificate # for individual products available upon request.

Device

A

B

C

D

E

FG

Figure

TS250 (All)

4.60

1.80

6.10

—

—

——

T18

(0.180)

(0.070)

(0.240)

—

—

——

TSV250 (All)

2.29

2.41

6.35

3.43

—

——

T19

(0.090)

(0.095)

(0.250)

(0.135)

—

——

TSL250 (All)

3.60

1.80

5.50

—

—

——

T18

(0.140)

(0.070)

(0.220)

—

—

——

TS600 (All)

10.42

3.30

3.35

—

—

——

T18

(0.410)

(0.130)

(0.132)

—

—

——

TSM600 (All)

5.20

17.80

5.54

6.75

2.08

3.12

8.39

T20

(0.205)

(0.701)

(0.218)

(0.266)

(0.082)

(0.123)

(0.331)

A

B

CB

Figure T18

A

A

B

B

C

D

Figure T19

A

B

C

D

G

E

F

Figure T20

Table T7

Recommended Pad Layouts for Surface-mount Telecommunications and Networking

Devices in millimeters (inches) Nominal