ADS1605

ADS1606

SBAS274H − MARCH 2003 − REVISED MAY 2007

www.ti.com

2

PRODUCT

PACKAGE−LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT

MEDIA, QUANTITY

ADS1605

HTQFP−64

PAP

−40

°C to +85°C

ADS1605I

ADS1605IPAPT

Tape and Reel, 250

ADS1605

HTQFP−64

PAP

−40

°C to +85°C

ADS1605I

ADS1605IPAPR

Tape and Reel, 1000

ADS1606

HTQFP−64

PAP

−40

°C to +85°C

ADS1606I

ADS1606IPAPT

Tape and Reel, 250

ADS1606

HTQFP−64

PAP

−40

°C to +85°C

ADS1606I

ADS1606IPAPR

Tape and Reel, 1000

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web

site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

ADS1605, ADS1606

UNIT

AVDD to AGND

−0.3 to +6

V

DVDD to DGND

−0.3 to +3.6

V

IOVDD to DGND

−0.3 to +6

V

AGND to DGND

−0.3 to +0.3

V

Input Current

100mA, Momentary

Input Current

10mA, Continuous

Analog I/O to AGND

−0.3 to AVDD + 0.3

V

Digital I/O to DGND

−0.3 to IOVDD + 0.3

V

Maximum Junction Temperature

+150

°C

Operating Temperature Range

−40 to +105

°C

Storage Temperature Range

−60 to +150

°C

Lead Temperature (soldering, 10s)

+260

°C

(1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods

may degrade device reliability. These are stress ratings only, and

functional operation of the device at these or any other conditions

beyond those specified is not implied.

PRODUCT FAMILY

PRODUCT

RESOLUTION

DATA RATE

FIFO?

ADS1605

16 Bits

5.0MSPS

No

ADS1606

16 Bits

5.0MSPS

Yes

ADS1625

18 Bits

1.25MSPS

No

ADS1626

18 Bits

1.25MSPS

Yes

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be

handled with appropriate precautions. Failure to observe

proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could

cause the device not to meet its published specifications.