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AN4671 Scheda tecnica(PDF) 5 Page - STMicroelectronics |
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AN4671 Scheda tecnica(HTML) 5 Page - STMicroelectronics |
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5 / 17 page ![]() AN4671 How to minimize switching losses DocID027654 Rev 1 5/17 Figure 2: SiC MOSFET dynamic characterization test circuit 2.1 Turn-off energy (Eoff) dependence on Rg and Vgs-off As with any majority carrier device, SiC MOSFETs have no tail, so the turn-off switching energy (Eoff) is due to the overlap between the drain-source voltage and drain current during the voltage rise time and the current fall time. Turn-off losses inherently depend on the device itself (as opposed to turn-on switching losses, which can depend on the reverse recovery charge of an external silicon or SiC diode, as in BOOST converters and many other topologies), hence the unrivaled turn-off speed of the SiC MOSFET is a feature of this new technology that separates it from other 1200 V power actuators. Eoff can be lowered by draining more current from the gate, by either: • reducing the gate resistance (Rg) • using a negative bias gate voltage during off time The SCT30N120 Eoff dependence on gate resistance is illustrated below. |
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