LM5122ZPWPR datasheet(6/51 Pages) TI1

6 / 51 page

LM5122, LM5122-Q1

SNVS954G – FEBRUARY 2013 – REVISED MAY 2016

www.ti.com

Product Folder Links: LM5122 LM5122-Q1

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(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings: LM5122

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per JESD22-A114 (1)

±2000

Charged device model (CDM), per JESD22-C101 (2)

±1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 ESD Ratings: LM5122-Q1

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

±2000

Charged device model (CDM), per AEC

Q100-011

Corner pins (1, 10, 11,

and 20)

±1000

Other pins

±1000

(1)

Recommended Operating Conditions are conditions under which operation of the device is intended to be functional, but does not

guarantee specific performance limits.

(2)

Minimum VIN operating voltage is always 4.5 V. The minimum input power supply voltage can be 3.0 V after start-up, assuming VIN

voltage is supplied from an available external source.

6.4 Recommended Operating Conditions

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input supply voltage(2)

VIN

4.5

Low-side driver bias voltage

VCC

High-side driver bias voltage

BST to SW

3.8

Current sense common mode

range(2)

CSP, CSN

Switch node voltage

100

Junction temperature

–40

125

ºC

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Thermal Information

THERMAL METRIC(1)

LM5122/

LM5122-Q1

UNIT

PWP

20 PINS

RθJA

Junction-to-ambient thermal resistance (Typ.)

ºC/W

RθJC(bot)

Junction-to-case (bot) thermal resistance (Typ.)

ºC/W

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