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ST25DV64K Scheda tecnica(PDF) 190 Page - STMicroelectronics |
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ST25DV64K Scheda tecnica(HTML) 190 Page - STMicroelectronics |
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190 / 220 page ![]() Package information ST25DV04K ST25DV16K ST25DV64K 190/220 DocID027603 Rev 4 Figure 83. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended footprint 1. Dimensions are expressed in millimeters. H - 0.346 - - 0.0136 - I - 1.039 - - 0.0409 - J - 0.200 - - 0.0079 - F - 0.314 - - 0.0124 - G - 0.342 - - 0.0135 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 220. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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