ST25DV64K datasheet(218/220 Pages) STMICROELECTRONICS

218 / 220 page

Revision history

ST25DV04K ST25DV16K ST25DV64K

218/220

DocID027603 Rev 4

Revision history

Table 257. Document revision history

Date

Revision

Changes

23-Feb-2017

Initial release.

20-Sep-2017

Updated:

– Features

– Section 4: Memory management

– Section 5: ST25DVxxx specific features

– Section 5.6.4: System memory protection

– Section 6.4.2: I2C Sequential write

– Section 6: I2C operation

– Section 7: RF operations

– Section 9.1: Maximum rating

– Table 121: Get System Info response format Error_flag is NOT set

– Table 203: Absolute maximum ratings

– Table 205: AC test measurement conditions

– Table 207: I2C DC characteristics up to 85°C

– Table 209: I2C AC characteristics up to 85°C

– Table 211: GPO DC characteristics up to 85°C

– Table 214: RF characteristics

– Table 215: Operating conditions

– Table 217: TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch,

package mechanical data

– Table 221: Ordering information scheme

– Figure 30: I2C Present Password Sequence

– Figure 31: I2C Write Password Sequence

– Figure 79: TSSOP8 – 8-lead thin shrink small outline, 3 x 6.4 mm, 0.65 mm pitch,

package outline

Added:

– Table 122: Memory size

– Table 204: I2C operating conditions

– Table 208: I2C DC characteristics up to 125°C

– Table 210: I2C AC characteristics up to 125°C

– Table 212: GPO DC characteristics up to 125°C

04-Oct-2017

Updated:

– Features

– Section 10: Package information

Added:

– NFC certified logo

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