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ST25DV64K Scheda tecnica(PDF) 219 Page - STMicroelectronics |
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ST25DV64K Scheda tecnica(HTML) 219 Page - STMicroelectronics |
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219 / 220 page ![]() DocID027603 Rev 4 219/220 ST25DV04K ST25DV16K ST25DV64K Revision history 219 19-Dec-2017 4 Added: – Figure 4: ST25DVxxx 10-ball WLCSP package connections with Cmos interrupt output (GPO) – Section 10.5: WLCSP10 package information – Table 220: WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data – Figure 82: WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline – Figure 83: WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale recommended footprint Updated: – Features – Section 1: Description – Section 2.5: Energy harvesting analog output (V_EH) – Section 5.3.2: Energy harvesting feature description – Figure 21: ST25DVxxx, Arbitration between RF and I2C – Section 6.4.1: I2C Byte write – Section 6.4.2: I2C Sequential write – Table 203: Absolute maximum ratings – Table 204: I2C operating conditions – Table 221: Ordering information scheme Deleted: – Device summary Table 257. Document revision history (continued) Date Revision Changes |
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