OrderableDevice datasheet(12/76 Pages) TI1

12 / 76 page

TLV9051, TLV9052, TLV9054

SBOS942F – AUGUST 2018 – REVISED JUNE 2019

www.ti.com

Product Folder Links: TLV9051 TLV9052 TLV9054

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Current limit input signals that can swing more than 0.5 V beyond the supply

rails to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

7 Specifications

7.1 Absolute Maximum Ratings

over operating junction temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

Signal input pins

Voltage(2)

Common-mode

(V–) – 0.5

(V+) + 0.5

Differential

VS + 0.2

Current(2)

–10

Output short-circuit(3)

Continuous

Operating ambient temperature, TA

–40

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±4000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

7.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

1.8

5.5

VIN

Input pin voltage

(V–) – 0.1

(V+) + 0.1

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

This package option is for preview only.

7.4 Thermal Information for Single Channel

THERMAL METRIC(1)

TLV9051, TLV9051S

UNIT

DPW (X2SON)(2)

DBV (SOT-23)(2)

DCK

(SC70)(2)

DRL

(SOT553)(2)

5 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal

resistance

470.0

228.1

210.8

231.2

TBD

°C/W

RθJC(top)

Junction-to-case(top) thermal

resistance

211.9

152.1

144.4

TBD

°C/W

RθJB

Junction-to-board thermal resistance

334.8

97.7

92.3

78.6

TBD

°C/W

ψJT

Junction-to-top characterization

parameter

29.8

74.1

76.2

51.3

TBD

°C/W

ψJB

Junction-to-board characterization

parameter

333.2

97.3

92.1

78.3

TBD

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal

resistance

N/A

TBD

°C/W

OrderableDevice Scheda tecnica(PDF) 12 Page - Texas Instruments

OrderableDevice Scheda tecnica(HTML) 12 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76

Scheda tecnica Scarica

Link URL