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LP87702 Scheda tecnica(PDF) 97 Page - Texas Instruments |
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LP87702 Scheda tecnica(HTML) 97 Page - Texas Instruments |
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97 / 98 page ![]() www.ti.com EXAMPLE STENCIL DESIGN 32X (0.6) 32X (0.25) 28X (0.5) (4.8) (4.8) 4X ( 1.49) (0.845) (0.845) (R0.05) TYP VQFN - 0.9 mm max height RHB0032N PLASTIC QUAD FLATPACK - NO LEAD 4222893/B 02/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 33 SYMM METAL TYP SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 33: 75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:20X SYMM 1 8 9 16 17 24 25 32 |
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