| Motore di ricerca datesheet componenti elettronici |
|
HMC554ALC3BTR-R5 Scheda tecnica(PDF) 26 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
HMC554ALC3BTR-R5 Scheda tecnica(HTML) 26 Page - Analog Devices |
|
26 / 26 page ![]() HMC554ALC3B Data Sheet Rev. A | Page 26 of 26 OUTLINE DIMENSIONS 0.50 BSC 0.32 BSC BOTTOM VIEW TOP VIEW SIDE VIEW 0.08 BSC 1 4 6 7 9 10 12 3 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.36 0.30 0.24 PIN 1 EXPOSED PAD PIN 1 INDICATOR 3.05 2.90 SQ 2.75 2.10 BSC 1.00 REF 1.60 1.50 SQ 1.40 0.90 0.80 0.70 SEATING PLANE Figure 86. 12-Terminal Ceramic Leadless Chip Carrier (LCC) (E-12-4) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range MSL Rating2 Package Description Package Option HMC554ALC3B −40°C to +85°C MSL3 12-Terminal Ceramic [LCC] E-12-4 HMC554ALC3BTR −40°C to +85°C MSL3 12-Terminal Ceramic [LCC] E-12-4 HMC554ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal Ceramic [LCC] E-12-4 EV1HMC554ALC3B Evaluation PCB Assembly 1 All models are RoHS compliant. 2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2. ©2018–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13895-0-10/19(A) |
|
Link URL |
| Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | Collegamento alla scheda tecnica | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |