Data Sheet

HMC554ALC3B

Rev. A | Page 5 of 26

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

GND

7

GND

8

RF

9

GND

10

11

12

4

2

LO

3

GND

5

6

PACKAGE

BASE

GND

NOTES

1. NOT INTERNALLY CONNECTED. THESE PINS

CAN BE CONNECTED TO RF/DC GROUND.

PERFORMANCE IS NOT AFFECTED.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF/DC GROUND.

HMC554ALC3B

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 3, 4, 6, 7, 9

GND

Ground. These pins and package bottom must be connected to RF/dc ground.

2

LO

LO Port. This pin is ac-coupled and matched to 50 Ω.

5

IF

IF Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block this port

externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For

operation to dc, this pin must not source/sink more than 3 mA of current or die malfunction and

possible die failure may result.

8

RF

RF Port. This pin is ac-coupled and matched to 50 Ω.

10, 11, 12

NIC

Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.

EPAD

Exposed Pad. The exposed pad must be connected to RF/dc ground.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface Schematic

LO

Figure 4. LO Interface Schematic

IF

Figure 5. IF Interface Schematic

RF

Figure 6. RF Interface Schematic