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HMC554ALC3BTR-R5 Scheda tecnica(PDF) 1 Page - Analog Devices

Il numero della parte HMC554ALC3BTR-R5
Spiegazioni elettronici  10 GHz to 20 GHz, GaAs, MMIC, Double Balanced Mixer
PDF  26 Pages
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Produttore elettronici  AD [Analog Devices]
Homepage  http://www.analog.com
Logo AD - Analog Devices

HMC554ALC3BTR-R5 Scheda tecnica(HTML) 1 Page - Analog Devices

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10 GHz to 20 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet
HMC554ALC3B
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevicesforitsuse,norforanyinfringementsofpatentsorother
rightsofthirdpartiesthatmayresultfromitsuse.Specificationssubjecttochangewithoutnotice.No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2018–2019 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
FEATURES
Conversion loss: 8.5 dB
LO to RF isolation: 37 dB
Input IP3: 20 dBm
RoHS compliant, 2.90 mm × 2.90 mm, 12-terminal LCC package
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
GND
7
GND
8
RF
9
GND
10
11
12
4
2
LO
3
GND
5
6
PACKAGE
BASE
GND
HMC554ALC3B
Figure 1.
GENERAL DESCRIPTION
The HMC554ALC3B is a general-purpose, double balanced
mixer in a leadless RoHS compliant leadless chip carrier (LCC)
package that can be used as an upconverter or downconverter
between 10 GHz and 20 GHz. This mixer is fabricated in a
gallium arsenide (GaAs) metal semiconductor field effect
transistor (MESFET) process and requires no external
components or matching circuitry. The HMC554ALC3B
provides excellent local oscillator (LO) to RF and LO to
intermediate frequency (IF) isolation due to optimized balun
structures. The RoHS compliant HMC554ALC3B eliminates the
need for wire bonding and is compatible with high volume
surface-mount manufacturing techniques.


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