PIMXRT406LCFP4A datasheet(19/100 Pages) NXP

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Electrical characteristics

i.MX RT1020 Crossover Processors for Industrial Products, Rev. 2, 03/2021

NXP Semiconductors

4.1.2.2

14 x 14 mm package thermal resistance

Table 9 displays the 14 x 14 mm LQFP package thermal resistance data.

4.1.3

Operating ranges

Table 11 provides the operating ranges of the i.MX RT1020 processors. For details on the chip's power

structure, see the “Power Management Unit (PMU)” chapter of the i.MX RT1020 Reference Manual

(IMXRT1020RM).

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 10. 14 x 14 mm package thermal resistance data

Rating

Test Conditions

Symbol

Value

Unit

Notes

Junction to Ambient

Natural convection

Single-layer board (1s)

RJA

oC/W

1,2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or

2s2p board, respectively.

Junction to Ambient

Natural convection

Four-layer board (2s2p)

RJA

oC/W

1,2

Junction to Ambient (@200

ft/min)

Single layer board (1s)

RJMA

oC/W

1,3

3 Per JEDEC JESD51-6 with forced convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or

2s2p board, respectively.

Junction to Ambient (@200

ft/min)

Four layer board (2s2p)

RJMA

oC/W

1,3

Junction to Board

—

RJB

oC/W

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

Junction to Case

—

RJC

oC/W

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Junction to Package Top

Natural Convection

JT

oC/W

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

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