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MCP3202 Scheda tecnica(PDF) 17 Page - Microchip Technology |
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MCP3202 Scheda tecnica(HTML) 17 Page - Microchip Technology |
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17 / 28 page ![]() © 2006 Microchip Technology Inc. DS21034D-page 17 MCP3202 7.0 PACKAGING INFORMATION 7.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN 8-Lead TSSOP Example: MCP3202 I/PNNN YYWW MCP3202 ISNYYWW NNN 8-Lead MSOP Example: XXXX YYWW NNN XXXXXX YWWNNN 3202 IYWW NNN 3202I YWWNNN * Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e |
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