MCP3202

DS21034D-page 20

© 2006 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) [MSOP]

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

L

L1

ϕ

c

A2

A1

A

b

2

1

NOTE 1

e

E

E1

D

N

Number of Pins

Pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Foot Angle

Lead Thickness

Lead Width

Units

Dimension Limits

N

e

A

A2

A1

E

E1

D

L

L1

ϕ

c

b

—

0.75

0.00

0.40

0°

0.08

0.22

8

0.65 BSC

—

0.85

—

4.90 BSC

3.00 BSC

3.00 BSC

0.60

0.95 REF

—

—

—

1.10

0.95

0.15

0.80

8°

0.23

0.40

MIN

NOM

MAX

MILLIMETERS

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–111, Sept. 8, 2006