DIO7S104

Version 1.5, Dec 2025

www.dioo.com

© 2025 Dioo Microcircuits Co., Ltd. Jiangsu

III

Table of Contents

1. Pin Assignment and Functions ........................................................................................................................... 1

2. Absolute Maximum Ratings ................................................................................................................................ 2

3. Recommended Operating Conditions .................................................................................................................3

4. ESD Ratings ........................................................................................................................................................3

5. Thermal Considerations ......................................................................................................................................3

6. Electrical Characteristics .....................................................................................................................................4

6.1. General electrical characteristics ............................................................................................................. 4

6.2. Switching characteristics ..........................................................................................................................7

7. Typical Characteristics ......................................................................................................................................14

8. Parameter Measurement Information ...............................................................................................................15

9. Block Diagram ...................................................................................................................................................16

10. Function Description ....................................................................................................................................... 17

10.1. Power up and power down sequence ..................................................................................................17

10.2. Architecture .......................................................................................................................................... 17

10.3. Enable and disable ...............................................................................................................................18

10.4. Pullup or pulldown resistors on I/O lines ..............................................................................................18

10.5. Device functional modes ...................................................................................................................... 18

11. Application Information ....................................................................................................................................19

11.1. Typical application ................................................................................................................................ 19

11.2. Design requirements ............................................................................................................................ 19

12. Physical Dimensions .......................................................................................................................................20

12.1. TSSOP-14 ............................................................................................................................................ 20

12.2. QFN2.0*1.7-12 ..................................................................................................................................... 20

List of Figures

Figure 1. TSSOP-14 (Top view) ........................................................................................................................... 1

Figure 2. QFN2.0*1.7-12 (Top view) .......................................................................................................................1

Figure 3. ICCB vs. VCCB...........................................................................................................................................14

Figure 4. ICCA vs. VCCA...........................................................................................................................................14

Figure 5. Push-pull driver, signal is translated from A Port to B Port ....................................................................14

Figure 6. Load circuits and voltage waveforms.................................................................................................... 15

Figure 7. Power up and power down sequence, tup / tdown ≥ 100 μs .....................................................................17

Figure 8. Architecture of DIO7S104 device I/O cell ..............................................................................................17

List of Tables

Table 1. Pin description ...........................................................................................................................................1

Table 2. Design parameters ..................................................................................................................................19