DIO7S104

Version 1.5, Dec 2025

www.dioo.com

© 2025 Dioo Microcircuits Co., Ltd. Jiangsu

3

3. Recommended Operating Conditions

Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications.

The ratings are obtained over an operating free-air temperature range unless otherwise specified.

Symbol

Parameter

VCCA

VCCB

Min

Max

Unit

VCCA

Supply voltage

1.08

3.6

V

VCCB

Supply voltage

1.65

5.5

V

VIH

High-level input

voltage

Data inputs

1.08 V to 3.6 V

1.65 V to 5.5 V

VCCI - 0.4

VCCI

V

OE

1.08 V to 3.6 V

1.65 V to 5.5 V VCCA × 0.65

3.6

VIL

Low-level input voltage

Data inputs

1.08 V to 1.4 V

1.65 V to 5.0 V

0.15

V

1.4 V to 3.6 V

1.65 V to 5.5 V

0.3

OE

1.08 V to 3.6 V

1.65 V to 5.5 V

0

VCCA × 0.35

VO

Voltage range applied

to any output in the

high or low state

A port

1.08 V to 3.6 V

1.65 V to 5.5 V

0

3.6

V

B port

1.08 V to 3.6 V

1.65 V to 5.5 V

0

5.5

V

Δt/ΔV

Input transition rise or

fall rate

A port inputs

1.08 V to 3.6 V

1.65 V to 5.5 V

40

ns/V

B port inputs

1.08 V to 3.6 V

1.65 V to 3.6 V

40

1.08 V to 3.6 V

4.5 V to 5.5 V

30

TA

Operating free-air temperature

-40

85

°C

4. ESD Ratings

When a statically-charged person or object touches an electrostatic discharge sensitive device, the electrostatic

charge might be drained through sensitive circuitry in the device. If the electrostatic discharge possesses

sufficient energy, damage might occur to the device due to localized overheating.

Model

Metric

Value

Unit

Human-body model

ANSI/ESDA/JEDECJS-001

±5000

V

Charged-device model

ANSI/ESDA/JEDECJS-002

±2000

V

5. Thermal Considerations

The thermal resistance determines the heat insulation property of a material. The higher the thermal resistance

is, the lower the heat loss. Accumulation of heat energy degrades the performance of semiconductor

components.

Symbol

Parameter

Value

Unit

RθJA

Junction-to-ambient thermal

resistance

TSSOP-14

120

°C/W

QFN2.0*1.7-12

120

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

TSSOP-14

50

°C/W

QFN2.0*1.7-12

43

°C/W