STA680 datasheet(40/43 Pages) STMICROELECTRONICS

40 / 43 page

Package information

STA680

40/43

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 14. LQFP144 (20x20mm) mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.600

0.0630

0.050

0.150 0.0020

0.0059

1.350

1.400

1.450 0.0531 0.0551 0.0571

0.170

0.220

0.270 0.0067 0.0087 0.0106

0.090

0.200 0.0035

0.0079

21.800 22.000 22.200 0.8583 0.8661 0.8740

19.800 20.000 20.200 0.7795 0.7874 0.7953

17.500

0.6890

21.800 22.000 22.200 0.8583 0.8661 0.8740

19.800 20.000 20.200 0.7795 0.7874 0.7953

17.500

0.6890

0.500

0.0197

0.450

0.600

0.750 0.0177 0.0236 0.0295

1.000

0.0394

0˚(min.), 3.5˚(typ.), 7˚(max.)

ccc

0.080

0.0031

LQFP144 (20x20x1.40mm)

Low profile plastic Quad Flat Package

Note 1: Exact shape of each corner is optional.

0099183 C

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