MB9DF565MLE datasheet(39/109 Pages) SPANSION

39 / 109 page

D at aS he e t

MB9D560_DS708-00001-3v0-E, May 15, 2015

CONFIDENTIAL

Latch-up

Semiconductor devices are constructed by the formation of P-type and N-type areas on a substrate. When

subjected to abnormally high voltages, internal parasitic PNPN junctions (called thyristor structures) may be

formed, causing large current levels in excess of several hundred mA to flow continuously at the power

supply pin. This condition is called latch-up.

CAUTION: The occurrence of latch-up not only causes loss of reliability in the semiconductor device, but

can cause injury or damage from high heat, smoke or flame. To prevent this from happening, do the

following:

(1) Be sure that voltages applied to pins do not exceed the absolute maximum ratings. This should

include attention to abnormal noise, surge levels, etc.

(2) Be sure that abnormal current flows do not occur during the power-on sequence.

Observance of Safety Regulations and Standards

Most countries in the world have established standards and regulations regarding safety, protection from

electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards

in the design of products.

Fail-Safe Design

Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage

or loss from such failures by incorporating safety design measures into your facility and equipment such as

redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions.

Precautions Related to Usage of Devices

Spansion semiconductor devices are intended for use in standard applications (computers, office

automation and other office equipment, industrial, communications, and measurement equipment, personal

or household devices, etc.).

CAUTION: Customers considering the use of our products in special applications where failure or abnormal

operation may directly affect human lives or cause physical injury or property damage, or where extremely

high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor

repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with

sales representatives before such use. The company will not be responsible for damages arising from such

use without prior approval.

7.2 Precautions for Package Mounting

Package mounting may be either lead insertion type or surface mount type. In either case, for heat

resistance during soldering, you should only mount under Spansion’s recommended conditions. For detailed

information about mount conditions, contact your sales representative.

Lead Insertion Type

Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct

soldering on the board, or mounting by using a socket.

Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board

and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the soldering

process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage

temperature. Mounting processes should conform to Spansion recommended mounting conditions.

If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can

lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment

of socket contacts and IC leads be verified before mounting.

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