MB9DF565MLE datasheet(40/109 Pages) SPANSION

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D at aS he e t

May 15, 2015, MB9D560_DS708-00001-3v0-E

CONFIDENTIAL

Surface Mount Type

Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads

are more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results

in increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.

You must use appropriate mounting techniques. Spansion recommends the solder reflow method, and has

established a ranking of mounting conditions for each product. Users are advised to mount packages in

accordance with Spansion ranking of recommended conditions.

Lead-Free Packaging

CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic

soldering, junction strength may be reduced under some conditions of use.

Storage of Semiconductor Devices

Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions

will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed

moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To

prevent, do the following:

(1) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the

product.

Store products in locations where temperature changes are slight.

(2) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and

at temperatures between 5 ˚C and 30 ˚C.

When you open Dry Package that recommends humidity 40% to 70% relative humidity.

(3) When necessary, Spansion packages semiconductor devices in highly moisture-resistant

aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum

laminate bags for storage.

(4) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.

Baking

Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the Spansion

recommended conditions for baking.

Condition: 125 ˚C/24 h

Static Electricity

Because semiconductor devices are particularly susceptible to damage by static electricity, you must take

the following precautions:

(1) Maintain relative humidity in the working environment between 40% and 70%.

Use of an apparatus for ion generation may be needed to remove electricity.

(2) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.

(3) Eliminate static body electricity by the use of rings or bracelets connected to ground through high

resistance (on the level of 1 MΩ).

Wearing of conductive clothing and shoes, use of conductive floor mats and other measures to

minimize shock loads is recommended.

(4) Ground all fixtures and instruments, or protect with anti-static measures.

(5) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board

assemblies.

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