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Packaging-8
D
1.800 ± 0.025
36-Lead Flatpack, Dual Cavity (100-MIL Lead Spacing)
TOP VIEW
END VIEW
E
0.750 ± 0.015
Notes:
1 All package finishes are per MIL-M-38510.
2. It is recommended that package ceramic be mounted to
aheatremovalraillocatedontheprintedcircuitboard.
A thermally conductive material such as MERECO XLN-589 or
equivalent should be used.
3. Letter designations are for cross-reference to MIL-M-38510.
PIN 1 I.D.
(Geometry Optional)
L
0.490
MIN.
b
0.015 ± 0.002
e
0.10
c
0.008
+ 0.002
- 0.001
Q
0.080 ± 0.010
(At Ceramic Body)
A
0.130 MAX.
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