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Packaging-10
36-Lead Side-Brazed DIP, Dual Cavity
TOP VIEW
END VIEW
E
0.590 ± 0.012
Notes:
1. All package finishes are per MIL-M-38510.
2. It is recommended that package ceramic be mounted to
a heat removal rail located on the printed circuit board.
A thermally conductive material such as MERECO XLN-589
or equivalent should be used.
3. Letter designations are for cross-reference to MIL-M-38510.
PIN 1 I.D.
(Geometry Optional)
SIDE VIEW
S1
0.005 MIN.
D
1.800 ± 0.025
S2
0.005 MAX.
e
0.100
A
0.155 MAX.
L/L1
0.150 MIN.
C
0.010 + 0.002
- 0.001
E1
0.600 + 0.010
(At Seating Plane)
b
0.018 ± 0.002
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