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BT817/8 Advanced Embedded Video Engine Datasheet

Version 1.1

Document No.: BRT_000302 Clearance No.: BRT#154

8.3 Solder Reflow Profile

The recommended solder reflow profile for the package is shown in Figure 8-2.

Figure 8-2 BT817/8 Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Figure 8-2. Values are shown for

both a completely Pb free solder process (i.e. the BT817/8 is used with Pb free solder), and for a non-Pb

free solder process (i.e. the BT817/8 is used with non-Pb free solder).

Profile Feature

Pb Free Solder

Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical

Temperature TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C 60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak

Temperature (tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature,

8 minutes Max.

6 minutes Max.

Table 8-1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

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