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LPC2888 Scheda tecnica(PDF) 30 Page - NXP Semiconductors |
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LPC2888 Scheda tecnica(HTML) 30 Page - NXP Semiconductors |
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30 / 34 page ![]() LPC2880_LPC2888_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Preliminary data sheet Rev. 01 — 22 June 2006 30 of 34 Philips Semiconductors LPC2880; LPC2888 16/32-bit ARM microcontrollers with external memory interface 10. Package outline Fig 4. Package outline SOT640-1 (TFBGA180) 0.5 A1 b A2 UNIT Dy e REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 01-06-07 03-03-03 IEC JEDEC JEITA mm 1.11 0.31 0.19 0.84 0.76 10.1 9.9 y1 10.1 9.9 0.39 0.29 0.12 0.1 e1 8.5 e2 8.5 DIMENSIONS (mm are the original dimensions) SOT640-1 MO-195 E 0.1 v 0.15 w 0 2.5 5 mm scale SOT640-1 TFBGA180: plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm A max. A A2 A1 detail X y y1 C e e b X D E C A B C D E F H J K L M N P R T U V G 2468 9 10 11 12 13 14 15 16 17 18 1357 B A e2 e1 ball A1 index area ball A1 index area A C C B ∅ v M ∅ w M 1/2 e 1/2 e |
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