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TPS25751D Scheda tecnica(PDF) 65 Page - Texas Instruments

Il numero della parte TPS25751D
Spiegazioni elettronici  TPS25751 USB Type-C® and USB PD Controller with Integrated Power Switches Optimized for Power Applications
PDF  89 Pages
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Produttore elettronici  TI1 [Texas Instruments]
Homepage  http://www.ti.com
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TPS25751D Scheda tecnica(HTML) 65 Page - Texas Instruments

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The decoupling capacitors for LDO_3V3, LDO_1V5, and VIN_3V3 (C15, C16, and C17 respectively) need to
be placed as close as possible to TPS25751D device for optimal performance. For this example to minimize
solution size, the decoupling capacitors are placed on the bottom layer with their ground pads directly
underneath the ground pad of TPS25751D. Use a maximum of one via per pin from TPS25751D to the
decoupling capacitors if placed on a different layer. Use a minimum of 10mil trace width to route these three
traces, preferably with 16mil trace width if possible.
CC1 (pin 28) and CC2 (pin 29)
CC1 (C11) and CC2 (C10) capacitors need to be placed as close as possible to their respective pins and on the
same layer as the TPS25751D device. When routing the CCx traces, DO NOT via to another layer in between
the CCx pins of the TPS25751D to the CCx capacitors. Check to make sure the CCx capacitors are not place
outside the CC trace creating an antenna, instead have the traces pass directly through the CCx capacitor pads
as shown in the example layout (refer to figure 10-14 ). Use a minimum of 10mil trace width to ensure Vconn
support (5V/0.6A).
9.4.1.2.2.2 TPS25751D PP5V
The 10uF decoupling capacitor (C9) need to be placed as close as possible to the PP5V pins of TPS25751D.
DO NOT use traces for PP5V. The PP5V power plane needs to be sized to support up to 3.6A (up to 3A for
sourcing, 600mA for Vconn). When connecting the PP5V pins (pins 34 and 35) to the 5V power plane, use a
minimum of 4 vias in parallel and close to the device to improve current sharing. Minimize the bottle necks cause
by other vias or traces, large bottle necks reduces the efficiency of the power plane.
The bulk capacitors (C6, C7, and C8) represent capacitances from the system 5V rail, these are placed further
away from TPS25751D on the same PP5V power plane. Refer to figure 10-14 and figure 10-15 for placement
and trace reference.
9.4.1.2.2.3 TPS25751D PPHV
Place the PPHV decoupling capacitors (C12, C13, and C14) as close as possible to TPS25751D, these do not
need to be on the same layer as the device. The PPHV power plane needs to be sized to support up to 5A
of current. When connecting the PPHV plane to a different layer, use a minimum of 6 vias in parallel per layer
change. It is highly recommended to have more than 6 vias if possible for layer change to improve current
sharing and efficiency.
9.4.1.2.2.4 TPS25751D VBUS
VBUS (pins 32 and 33) and VBUS_IN (pins 23, 24, and 25)
Place the VBUS decoupling capacitor (C1) as close as possible to TPS25751D, the capacitor does not need to
be on the same layer as the device. The VBUS power plane need to be sized to support up to 5A of current if
100W application is required. When connecting the VBUS pins (pins 32 and 33) plane to a different layer, use
a minimum of 3 vias per layer change. When connecting the VBUS_IN pins (pins 23, 24, and 25) plane to a
different layer, use a minimum of 6 vias per layer change. Refer to figure 10-14 and figure 10-15 for capacitors
and via placement.
At the Type-C port/connector, it is recommended to use minimum of 6 vias from the connector VBUS pins for
layer changes. Place the 10nF caps (C2, C3, C4, and C5) and the 22V TVS diode (U2) as close as possible to
the connector VBUS pins as shown in figure 10-15.
When routing the VBUS power plane from the Type-C connector to the TPS25751D VBUS pins, minimize bottle
necks caused by other vias and traces to improve current flow. The example layout shown in figure 10-17 uses
an internal layer to route the VBUS plane from the connector to TPS25751D.
9.4.1.2.2.5 TPS25751D I/O (I2C, ADCINs, GPIOs)
I2C, ADCIN1/2, and GPIO pins
Fan these traces out from the TPS25751D, use vias to connect the net to a routing layer if needed. For these
nets, use 4mil to 10mil trace width.
www.ti.com
TPS25751
SLVSH93 – OCTOBER 2023
Copyright © 2023 Texas Instruments Incorporated
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