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TPS25751D Scheda tecnica(PDF) 73 Page - Texas Instruments |
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TPS25751D Scheda tecnica(HTML) 73 Page - Texas Instruments |
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73 / 89 page ![]() 9.4.2.2.2.7 TPS25751S GND The GND pad is used to dissipate heat for the TPS25751S device. Connect the GND pins (11, 12, 14 and 31) to the Ground pad (39) underneath the TPS25751S device. Connect the through hole vias from the ground pad on the top layer to a copper pour on the bottom layer to help dissipate heat. Additional vias can be added to improve thermal dissipation. www.ti.com TPS25751 SLVSH93 – OCTOBER 2023 Copyright © 2023 Texas Instruments Incorporated Submit Document Feedback 73 Product Folder Links: TPS25751 |
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