ADL8106ACEZ-R7 datasheet(6/26 Pages) AD

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Data Sheet

ADL8106

ABSOLUTE MAXIMUM RATINGS

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Rev. B | 6 of 26

Table 6.

Parameter

Rating

Drain Bias Voltage (VDD1 and VDD2)

4 V

Negative Gate Bias Voltage (VGG1)

−2.1 V to 0 V

RF Input Power (RFIN)

17 dBm

Continuous Power Dissipation (PDISS), TCASE = 85°C

(Derate 16.6 mW/°C Above 85°C)

1.49 W

Temperature

Storage Range

−55°C to +150°C

Operating Range

−40°C to +85°C

Quiescent Channel (TCASE = 85°C, VDDx = 3 V, IDQ =

120 mA, Input Power (PIN) = Off)

106.7°C

Maximum Channel

175°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to system design and oper-

ating environment. Careful attention to the PCB thermal design is

required.

θJC is the channel-to-case thermal resistance (channel to exposed

metal ground pad on the underside of the device).

Table 7. Thermal Resistance

Package Type

θJC1

Unit

CE-24-2

60.3

°C/W

1 Thermal resistance (θJC) was determined by simulation under the following

conditions: the heat transfer is due solely to thermal conduction from the

channel through the ground paddle to the PCB, and the ground paddle is held

constant at the operating temperature of 85°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of EDS-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADL8106

Table 8. ADL8106, 24-Terminal LGA_CAV

ESD Model

Withstand Threshold (V)

Class

HBM

±300

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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