RZSLASHT2M datasheet(9/128 Pages) RENESAS

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Table 1.11

Safety (2 of 2)

Feature

Functional description

Clock monitor circuit (CLMA)

● Monitors the abnormal output clock frequency from the input clock (main clock oscillator),

PLL circuit, or low-speed on-chip oscillator.

● Input clock oscillation stop detection: Available

Data operation circuit (DOC)

The function to compare, add, or subtract 16-bit data

Isolated peripherals

● Safety dedicated peripherals are available:

– GPT: 4 ch

– SCI: 1 ch

– IIC: 1 ch

– SPI: 1 ch

– CRC: 1 unit

– RTC: 1 unit

– GPIO: Sharable with normal GPIO

– On-chip system SRAM with ECC

● They are mapped independently from normal peripherals so that access protection can be

done by EL2 MPU.

Table 1.12

Security

Feature

Functional description

Security*1

● Secure boot

● JTAG authentication*2

● SCI/USB boot disable

● Cryptographic accelerators

– Symmetric Cipher: AES 128/192/256 bits with CBC/ECB/CTR/GCM/XTS

– Asymmetric Cipher: ECC 256 bits, RSA 1024/2048/3072 bits, RSAES-OAEP

– Hash: SHA-1, SHA-2

– Message authentication: HMAC, CMAC, GMAC

– Signature algorithms: ECDSA with NIST P-256, RSASSA-PSS, RSASSA-PKCS1

● TRNG

Note 1. For details, contact our sales representative.

Note 2. Authentication by plaintext is available in non-security support product.

Table 1.13

Debug

Feature

Functional description

Debugging interface

● CoreSight architecture designed by Arm

● Debugging function by the JTAG/SWD interface, and trace function by the trace port

interface

Table 1.14

Others

Feature

Functional description

Power supply voltage

VDD = 1.1 V (Core)

VCC18 = 1.8 V (PLL, USB, ADC, TSU)

VCC33 = 3.3 V (I/O, USB)

VCC1833 = 1.8 V (RGMII, xSPI) or 3.3 V (RMII/MII, xSPI*1)

Operating temperature

Tj = −40 to +125°C

Packages

320 pin FBGA 17 × 17 mm, 0.8-mm pitch

225 pin FBGA 13 × 13 mm, 0.8-mm pitch

176 pin LQFP (Exposed Die Pad) 24 × 24 mm, 0.5-mm pitch

128 pin LQFP (Exposed Die Pad) 20 × 14 mm, 0.5-mm pitch

Note 1. Maximum xSPI clock frequency is 75 MHz at 3.3 V.

RZ/T2M Datasheet

1. Overview

R01DS0383EJ0130 Rev.1.30

Mar 13, 2026

Page 9 of 128

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