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PCF8533U/2DA/2 Scheda tecnica(PDF) 45 Page - NXP Semiconductors

Il numero della parte PCF8533U/2DA/2
Spiegazioni elettronici  Universal LCD driver for low multiplex rates
PDF  45 Pages
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Produttore elettronici  NXP [NXP Semiconductors]
Homepage  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8533U/2DA/2 Scheda tecnica(HTML) 45 Page - NXP Semiconductors

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NXP Semiconductors
PCF8533
Universal LCD driver for low multiplex rates
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 March 2010
Document identifier: PCF8533_4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
23. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2
LCD bias generator . . . . . . . . . . . . . . . . . . . . . 5
7.3
LCD voltage selector . . . . . . . . . . . . . . . . . . . . 5
7.4
LCD drive mode waveforms . . . . . . . . . . . . . . . 7
7.4.1
Static drive mode . . . . . . . . . . . . . . . . . . . . . . . 7
7.4.2
1:2 multiplex drive mode. . . . . . . . . . . . . . . . . . 8
7.4.3
1:3 multiplex drive mode. . . . . . . . . . . . . . . . . 10
7.4.4
1:4 multiplex drive mode. . . . . . . . . . . . . . . . . 11
7.5
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.5.1
Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.5.2
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.6
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7.7
Display register . . . . . . . . . . . . . . . . . . . . . . . . 12
7.8
Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 12
7.9
Backplane outputs . . . . . . . . . . . . . . . . . . . . . 13
7.10
Display RAM . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7.11
Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.12
Subaddress counter . . . . . . . . . . . . . . . . . . . . 15
7.13
Output bank selector . . . . . . . . . . . . . . . . . . . 16
7.14
Input bank selector . . . . . . . . . . . . . . . . . . . . . 16
7.15
Blinker. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
8
I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . . 18
8.1
Characteristics of the I2C-bus. . . . . . . . . . . . . 18
8.1.1
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1.1.1
START and STOP conditions . . . . . . . . . . . . . 18
8.1.2
System configuration . . . . . . . . . . . . . . . . . . . 19
8.1.3
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.1.4
I2C-bus controller . . . . . . . . . . . . . . . . . . . . . . 20
8.1.5
Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.1.6
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 20
8.2
Command decoder . . . . . . . . . . . . . . . . . . . . . 22
8.3
Display controller . . . . . . . . . . . . . . . . . . . . . . 23
9
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 24
10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25
11
Static characteristics . . . . . . . . . . . . . . . . . . . . 26
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 28
13
Application information. . . . . . . . . . . . . . . . . . 31
13.1
Cascaded operation. . . . . . . . . . . . . . . . . . . . 31
14
Bare die description . . . . . . . . . . . . . . . . . . . . 34
14.1
Gold bump hardness . . . . . . . . . . . . . . . . . . . 34
14.2
Alignment marks . . . . . . . . . . . . . . . . . . . . . . 34
14.3
Bump locations . . . . . . . . . . . . . . . . . . . . . . . 34
15
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 38
16
Handling information . . . . . . . . . . . . . . . . . . . 39
17
Packing information . . . . . . . . . . . . . . . . . . . . 39
18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
19
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
20
Revision history . . . . . . . . . . . . . . . . . . . . . . . 42
21
Legal information . . . . . . . . . . . . . . . . . . . . . . 43
21.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 43
21.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
21.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 43
21.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 44
22
Contact information . . . . . . . . . . . . . . . . . . . . 44
23
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45



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