MPC8378E datasheet(115/127 Pages) FREESCALE

115 / 127 page

MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

115

Thermal

23 Thermal

This section describes the thermal specifications of the MPC8378E.

23.1

Thermal Characteristics

Table 77 provides the package thermal characteristics for the 689 31

× 31mm TePBGA II package.

23.2

Thermal Management Information

For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.

23.2.1

Estimation of Junction Temperature with Junction-to-Ambient

Thermal Resistance

An estimation of the chip junction temperature, TJ, can be obtained from the equation:

TJ = TA + (RθJA × PD)

where:

TJ = junction temperature (°C)

TA = ambient temperature for the package (°C)

RθJA = junction to ambient thermal resistance (°C/W)

Table 77. Package Thermal Characteristics for TePBGA II

Parameter

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection on single layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural convection on four layer board (2s2p)

RθJA

°C/W

1, 2, 3

Junction-to-ambient (at 200 ft/min) on single layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-board thermal

RθJB

°C/W

Junction-to-case thermal

RθJC

°C/W

Junction-to-package natural convection on top

°C/W

Note:

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

3 Per JEDEC JESD51-6 with the board horizontal.

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

MPC8378E Scheda tecnica(PDF) 115 Page - Freescale Semiconductor, Inc

MPC8378E Scheda tecnica(HTML) 115 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Scheda tecnica Scarica

Link URL