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MX25L6445E Scheda tecnica(PDF) 2 Page - Macronix International

Il numero della parte MX25L6445E
Spiegazioni elettronici  64M-BIT [x 1/x 2/x 4] CMOS MXSMIOTM (SERIAL MULTI I/O) FLASH MEMORY
PDF  72 Pages
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Produttore elettronici  MCNIX [Macronix International]
Homepage  http://www.macronix.com
Logo MCNIX - Macronix International

MX25L6445E Scheda tecnica(HTML) 2 Page - Macronix International

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MX25L6445E
P/N: PM1736
REV. 1.8, DEC. 26, 2011
Contents
FEATURES ..................................................................................................................................................................5
GENERAL DESCRIPTION .........................................................................................................................................7
Table 1. Additional Features .............................................................................................................................. 7
PIN CONFIGURATION ................................................................................................................................................8
PIN DESCRIPTION......................................................................................................................................................8
BLOCK DIAGRAM.......................................................................................................................................................9
DATA PROTECTION..................................................................................................................................................10
Table 2. Protected Area Sizes .......................................................................................................................... 11
Table 3. 4K-bit Secured OTP Definition............................................................................................................ 11
Memory Organization...............................................................................................................................................12
Table 4. Memory Organization ......................................................................................................................... 12
DEVICE OPERATION................................................................................................................................................13
Figure 1-1. Serial Modes Supported (for Normal Serial mode)........................................................................ 13
Figure 1-2. Serial Modes Supported (for Double Transfer Rate serial read mode).......................................... 13
COMMAND DESCRIPTION.......................................................................................................................................14
Table 5. Command Sets................................................................................................................................... 14
(1) Write Enable (WREN)................................................................................................................................. 16
(2) Write Disable (WRDI).................................................................................................................................. 16
(3) Read Identification (RDID).......................................................................................................................... 16
(4) Read Status Register (RDSR) .................................................................................................................... 17
(5) Write Status Register (WRSR).................................................................................................................... 18
Protection Modes ............................................................................................................................................. 18
(6) Read Data Bytes (READ) ........................................................................................................................... 19
(7) Read Data Bytes at Higher Speed (FAST_READ) ..................................................................................... 19
(8) Fast Double Transfer Rate Read (FASTDTRD).......................................................................................... 19
(9) 2 x I/O Read Mode (2READ) ...................................................................................................................... 19
(10) 2 x I/O Double Transfer Rate Read Mode (2DTRD) ................................................................................. 20
(11) 4 x I/O Read Mode (4READ)..................................................................................................................... 20
(12) 4 x I/O Double Transfer Rate Read Mode (4DTRD) ................................................................................. 21
(13) Sector Erase (SE)..................................................................................................................................... 21
(14) Block Erase (BE)....................................................................................................................................... 22
(15) Block Erase (BE32K) ................................................................................................................................ 22
(16) Chip Erase (CE)........................................................................................................................................ 22
(17) Page Program (PP)................................................................................................................................... 23
(18) 4 x I/O Page Program (4PP)..................................................................................................................... 23
Program/Erase Flow(1) with read array data ................................................................................................... 24
Program/Erase Flow(2) without read array data .............................................................................................. 25
(19) Continuously program mode (CP mode) .................................................................................................. 26
(20) Deep Power-down (DP)............................................................................................................................ 27
(21) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................ 27
(22) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4), (REMS4D)....................... 27
Table 6. ID Definitions ..................................................................................................................................... 28
(23) Enter Secured OTP (ENSO)..................................................................................................................... 28
(24) Exit Secured OTP (EXSO)........................................................................................................................ 28



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