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CS53L30 Scheda tecnica(PDF) 14 Page - Cirrus Logic |
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CS53L30 Scheda tecnica(HTML) 14 Page - Cirrus Logic |
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14 / 67 page ![]() 14 DS992F2 CS53L30 3 Characteristics and Specifications Table 3-10. Switching Specifications—Digital Mic Interface Test conditions (unless specified otherwise): Fig. 2-1 shows CS53L30 connections; GNDA = GNDD = 0 V; voltages are with respect to ground; parameters can vary with VA, typical performance data taken with VA = 1.8 V, VP = 3.6 V, min/max performance data taken with VA = 1.8 V, VP = 3.6 V; TA = +25°C; logic 0 = ground, logic 1 = VA; DMIC_DRIVE = 0 (normal); input timings are measured at VIL and VIH thresholds, and output timings are measured at VOL and VOH thresholds (see Table 3-14). Parameters 1,2 1.Digital mic interface timing 2.Oversampling rate of the digital mic must match the oversampling rate of the CS53L30 internal decimators. Symbol Min Max Units Output clock (DMICx_SCLK) frequency 1/tP —3.2[3] 3.The output clock frequency follows the internal MCLK rate divided by 2 or 4, as set in the ADCx/DMICx control registers (see DMIC1_SCLK_DIV on p. 53 and DMIC2_SCLK_DIV on p. 55). DMICx_SCLK is further divided by up to a factor of 4 when MCLK_INT_SCALE is set (see p. 48). MCLK source deviation from nominal supported rates is applied directly to the output clock rate by the same factor (e.g., a +100-ppm offset in the frequency of MCLK becomes a +100-ppm offset of DMICx_SCLK. MHz DMICx_SCLK duty cycle4 —45 55 % DMICx_SCLK rise time (10% to 90% of VA) 4 4.Timing guaranteed with pull-up or pull-down resistor, with a minimum value 10 k tied to DMIC2_SCLK/AD1 for I2C address determination. tr —21 ns DMICx_SCLK fall time (90% to 10% of VA) 4 tf —13 ns DMICx_SD setup time before DMICx_SCLK rising edge ts(SD-CLKR) 10 — ns DMICx_SD hold time after DMICx_SCLK rising edge th(CLKR-SD) 4— ns DMICx_SD setup time before DMICx_SCLK falling edge ts(SD-CLKF) 10 — ns DMICx_SD hold time after DMICx_SCLK falling edge th(CLKF-SD) 4— ns Table 3-11. Specifications—I2S Test conditions (unless specified otherwise): Fig. 2-1 shows CS53L30 connections; GNDA = GNDD = 0 V; all voltages are with respect to ground; parameters can vary with VA; typical performance data taken with VA = 1.8 V, VP = 3.6 V; min/max performance data taken with VA = 1.8 V, VP = 3.6 V; TA = +25°C; Test load for ASP_LRCK/FSYNC, ASP_SCLK, and ASP_SDOUTx CL = 60 pF; logic 0 = ground, logic 1 = VA; ASPx_DRIVE = 0; input timings are measured at VIL and VIH thresholds, and output timings are measured at VOL and VOH thresholds (see Table 3-14). Parameters 1,2 1.Serial port interface timing 2.MCLK must be stable before powering up the device. In Slave Mode, ASP_LRCK/FSYNC and ASP_SCLK must be stable before powering up the device. Before making changes to any clock setting, the device must be powered down by setting either the PDN_ULP or PDN_LP bit. Symbol Min Max Units MCLK frequency — 1.024 19.2 MHz MCLK duty cycle — 45 55 % Slave mode Input sample rate (LRCK) Fs (See Table 4-2)kHz LRCK duty cycle — 45 55 % SCLK frequency 1/tPs — 64•Fsext Hz SCLK duty cycle — 45 55 % SCLK rising edge to LRCK edge ths(LK-SK) 10 — ns LRCK setup time before SCLK rising edge tss(LK-SK) 40 — ns SDOUT setup time before SCLK rising edge tss(SDO-SK) 20 — ns SDOUT hold time after SCLK rising edge ths(SK-SDO) 30 — ns Master mode Output sample rate (LRCK) All speed modes Fsext (See Table 4-2)kHz LRCK duty cycle — 45 55 % SCLK frequency 1/tPm — 64•Fsext Hz SCLK duty cycle — 33 67 % LRCK time before SCLK falling edge tsm(LK-SK) –2 +2 ns SDOUT setup time before SCLK rising edge tsm(SDO-SK) 20 — ns SDOUT hold time after SCLK rising edge thm(SK-SDO) 30 — ns DMIC_CLK DMIC_SD Left (A, DATA1 ) Channel Data Right (B , DATA2) Channel Data Left (A, DATA1) Channel Data thm(SK-SDO) // // // // // // MSB LRCK SCLK SDOUT tPm tsm(SDO-SK) // // // // // // tsm(LK-SK) ths(SK-SDO) // // // // // // MSB LRCK SCLK SDOUT tss(LK-SK) tP tss(SDO-SK) // // // // // // ths(LK-SK) Serial Port Timing—Master Mode Serial Port Timing—Slave Mode |
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