CS53L30 datasheet(37/67 Pages) CIRRUS

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DS992F2

CS53L30

4.15 QFN Thermal Pad

Figure 4-20. Control Port Timing, I2C Reads with Preamble and Autoincrement

The following pseudocode illustrates an aborted write operation followed by a single read operation. For multiple read

operations, autoincrement would be set on (as is shown in Fig. 4-20).

Send start condition.

Send 10010100 (chip address and write operation).

Receive acknowledge bit.

Send MAP byte, autoincrement off.

Receive acknowledge bit.

Send stop condition, aborting write.

Send start condition.

Send 10010101 (chip address and read operation).

Receive acknowledge bit.

Receive byte, contents of selected register.

Send acknowledge bit.

Send stop condition.

Note: The device interrupt status register (at address 0x36) and the register that immediately precedes it (the device

interrupt mask register at address 0x35) must only be read individually and not as a part of an autoincremented

control-port read. An autoincremented read of either register may clear the contents of the interrupt status register

and return invalid interrupt status data. If an unmasked interrupt condition had caused INT to be asserted, INT

may be unintentionally deasserted.

Therefore, to avoid affecting interrupt status register contents, the autoincrement read must not include registers

at addresses 0x35 and 0x36; these registers must only be read individually.

4.15 QFN Thermal Pad

The underside of the compact QFN package reveals a large metal pad that serves as a thermal relief to provide for

maximum heat dissipation. Internal to the package, all grounds are connected to the thermal pad. This pad must mate with

an equally dimensioned copper pad on the PCB and must be electrically connected to ground. If necessary for thermal

reasons, a series of vias can be used to connect this copper pad to one or more larger ground planes on other PCB layers.

5 Systems Applications

This section describes the following system applications and considerations:

• Octal mic array application (Section 5.1)

• Power-up sequence (Section 5.2)

• Quick-mute sequencing (Section 5.3)

• Capture-path input considerations (Section 5.3)

• MCLK jitter (Section 5.5)

• Frequency response considerations (Section 5.6).

SCL

Chip Address (Write)

MAP Byte

Data

START

ACK

STOP

ACK

SDA

Chip Address (Read)

START

12 13 14 15

20 21 22 23 24

26 27 28

10 11

17 18 19

ACK

STOP

MAP Addr = Z

Addr = 1001010

Data

SDA

Source

Master

Pullup

Slave

Master

Pullup

Addr = 1001010

64 3

71 0

3 2

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