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MCP47FXB2XT-EST Scheda tecnica(PDF) 95 Page - Microchip Technology

Il numero della parte MCP47FXB2XT-EST
Spiegazioni elettronici  8/10/12-Bit Quad/Octal Voltage Output, 6 LSb INL Digital-to-Analog Converters with I짼C Interface
PDF  124 Pages
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Produttore elettronici  MICROCHIP [Microchip Technology]
Homepage  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP47FXB2XT-EST Scheda tecnica(HTML) 95 Page - Microchip Technology

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 2020 Microchip Technology Inc.
DS20006368A-page 95
MCP47FXBX4/8
8.3
Layout Considerations
Several layout considerations may be applicable to
your application. These may include:
• Noise
• PCB Area Requirements
8.3.1
NOISE
Particularly harsh environments may require shielding
of critical signals. Inductively-coupled AC transients
and digital switching noise can degrade the input and
output signal integrity, potentially masking the
MCP47FXBX4/8’s performance. Careful board layout
minimizes these effects and increases the Signal-to-
Noise Ratio (SNR).
Multi-layer boards utilizing a low-inductance ground
plane, isolated inputs, isolated outputs and proper
decoupling are critical to achieving the performance
that the silicon is capable to provide.
Separate digital and analog ground planes are
recommended. In this case, the VSS pin and the ground
pins of the VDD capacitors should be terminated to the
analog ground plane.
8.3.2
PCB AREA REQUIREMENTS
In some applications, PCB area is a criteria for device
selection. Table 8-1 shows the typical package
dimensions and area for the different package options.
Note:
Breadboards and wire-wrapped boards
are not recommended.
TABLE 8-1:
PACKAGE FOOTPRINT(1)
Package
Package Footprint
Type
Code
Dimensions
(mm)
Area (mm2)
Length Width
20 TSSOP
ST
3.00
4.90
14.70
20 VQFN
MQ
5
5
25
Note 1: Does not include recommended land
pattern dimensions. Dimensions are
typical values.



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