HMC1061LC5

Data Sheet

Rev. B | Page 16 of 18

APPLICATIONS INFORMATION

EVALUATION PRINTED CIRCUIT BOARD (PCB)

The evaluation PCB of the HMC1061LC5 uses RF circuit design

techniques. Signal lines must have 50 Ω impedance where as the

package ground leads must connect directly to the ground plane

similar to that shown in Figure 27.

The package base is internally connected to the VEE and VEECLKx

supply and must be connected to a VEE supply plane for heat

sinking. A sufficient number of via holes must be used to connect

the top and bottom ground planes to provide good RF grounding.

The evaluation circuit board shown in Figure 27 is available from

Analog Devices upon request.

Table 5. Bill of Materials for Evaluation PCB EVAL01-HMC1061LC51

Item

Description

J1, J2, J7, J8

SRI K connectors

J3 to J6

SRI SMA connectors

J9

Header, 0.9 inch, 9 pin, through hole

J10

DC pin

C1 to C6, C14

0.01 μF capacitors, 0402 package

C7 to C12

4.7 μF capacitors, tantalum

L1 to L4

Ferrite, 0402, Steward LI0402E300R-10

L5

Ferrite, 1206, Steward HI1206T500R-10

L6

Ferrite, 0603, Steward LI0603E470R-10

R16

0 Ω resistor, 0402 package

U1

HMC1061LC5 track-and-hold amplifier

PCB2

600-00176-00 evaluation board

Heatsink

Modified Wakefield 658-35AB (Digi-Key Part Number 345-1066-ND) 1.1 inch (length) × 0.825 inch (width) × 0.35 inch (height)

1 Reference this number when ordering complete evaluation PCB.

2 Use the Arlon 25FR or Rogers 4350 for circuit board material.