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FS6600 Scheda tecnica(PDF) 12 Page - NXP Semiconductors |
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FS6600 Scheda tecnica(HTML) 12 Page - NXP Semiconductors |
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12 / 166 page  NXP Semiconductors FS6600 Fail-safe system basis chip with multiple SMPS and LDO 9 Maximum ratings All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or permanently damage the device. Symbol Parameter Conditions Min Max Unit Voltage ratings VSUP1/2 DC voltage power supply VSUP1,2 pins −0.3 60 V WAKE1/2 DC voltage WAKE1,2 pins; external serial resistor mandatory −1.0 60 V DC voltage PRE_SW pin −2.0 60 V PRE_SW Transient voltage < 20 ns PRE_SW pin −3.0 60 V VMONx, FS0B DC voltage VMON1,2,3,4, VCOREMON, FS0B pins −0.3 60 V PRE_GHS, PRE_ BOOT DC voltage PRE_GHS, PRE_BOOT pins −0.3 65.5 V DBG DC voltage DBG pin −0.3 10 V BOOST_LS DC voltage BOOST_LS pin −0.3 8.5 V VBOOST, LDO1_IN DC voltage VBOOST, LDO1_IN pins −0.3 6.5 V BUCKx_IN DC voltage BUCK1_IN, BUCK2_IN, BUCK3_IN, BUCK3_INQ −1.0 5.5 V BUCKx_IN Transient voltage < 3 µs BUCK1_IN, BUCK2_IN, BUCK3_IN, BUCK3_INQ −1.0 6.5 V BUCKx_SW Transient voltage < 20 ns BUCK1_SW, BUCK2_SW, BUCK3_SW −2.0 6.5 V All other pins DC voltage at all other pins −0.3 5.5 V Current ratings I_WAKE Maximum current capability WAKE1,2 −5.0 5.0 mA I_SUP Maximum current capability VSUP1,2 −5.0 — mA Table 4. Maximum ratings 10 Electrostatic discharge 10.1 Human body model (JESD22/A114) The device is protected up to ±2 kV, according to the human body model standard with 100 pF and 1.5 kΩ. This protection is ensured at all pins. 10.2 Charged device model The device is protected up to ±500 V, according to the AEC Q100 - 011 charged device model standard. This protection is ensured at all pins. 10.3 Discharged contact test The device is protected up to ±8 kV, according to the following discharged contact tests. Discharged contact test (IEC61000-4-2) at 150 pF and 330 Ω Discharged contact test (ISO10605.2008) at 150 pF and 2 kΩ Discharged contact test (ISO10605.2008) at 330 pF and 2 kΩ FS6600 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 3 — 17 July 2024 Document feedback 12 / 166 |
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