FS6600 datasheet(13/166 Pages) NXP

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NXP Semiconductors

FS6600

Fail-safe system basis chip with multiple SMPS and LDO

This protection is ensured at VSUP1, VSUP2, WAKE1, WAKE2, FS0B pins.

11 Operating range

aaa-030983

OPERATION

NO OPERATION

RISK OF DAMAGE

VSUP1/2

60 V

EXTENDED

OPERATION

FULL OPERATION

EXTENDED

OPERATION

36 V

VSUP_UVH

5.1 V

LPI_DCR x IPRE +

VPRE_UVL/DMAX

Assumptions

LPI_DCR = 30 mΩ

DMAX = 98.18 % with FPRE_SW = 455 kHz and TPRE_OFF_MIN = 40 ns

IPRE = 3.0 A

VRBD = 0.56 V

VBAT_min = 3.4 V when VPRE = VPRE_UVL

Figure 4. Operating range

• Below VSUP_UVH threshold, the extended operation range depends on VPRE output voltage configuration

and external components.

– When VPRE is configured at 5.0 V, VPRE may not remain in its regulation range

– VSUP minimum voltage depends on external components (LPI_DCR) and application conditions (IPRE,

FPRE_SW)

• When VPRE is switching at 455 kHz, the FS6600 maximum continuous operating voltage is 36 V. It has been

validated at 48 V for limited duration of 15 minutes at room temperature to satisfy the jump-start requirement

of 24 V applications. It can sustain 58 V load dump without external protection.

• When VPRE is switching at 2.2 MHz, the FS6600 maximum continuous operating voltage is 18 V. It is

validated at 26 V for limited duration of 2 minutes at room temperature to satisfy the jump-start requirement of

12 V applications and 35 V load dump.

12 Thermal ratings

Symbol

Parameter

Conditions

Min

Max

Unit

RθJA

Thermal resistance junction to ambient 2s2p circuit board

[1] —

°C/W

RθJA

Thermal resistance junction to ambient 2s6p circuit board

[1] —

°C/W

RθJB

Thermal resistance junction to board

2s2p circuit board

[1] —

°C/W

RθJB

Thermal resistance junction to board

2s6p circuit board

[1] —

°C/W

RθJC_BOT

Thermal resistance junction to case

bottom

between the die and the solder pad on

the bottom of the package

[1] —

°C/W

RθJP_TOP

Thermal resistance junction to package

top

between package top and the junction

temperature

[1] —

°C/W

Ambient temperature (Grade 1)

−40

125

°C

Junction temperature (Grade 1)

−40

150

°C

TSTG

Storage temperature

−55

150

°C

Table 5. Thermal ratings

[1]

per JEDEC JESD51-2 and JESD51-8

FS6600

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 17 July 2024

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