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ADIN1300BCPZ-R7 Scheda tecnica(PDF) 95 Page - Analog Devices |
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ADIN1300BCPZ-R7 Scheda tecnica(HTML) 95 Page - Analog Devices |
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95 / 96 page ![]() Data Sheet ADIN1300 PCB LAYOUT RECOMMENDATIONS analog.com Rev. B | 95 of 96 The user has the capability to program the drive current of the RGMII pins to help improve signal integrity and minimize ringing. Alternatively, series termination resistors can be placed in all RGMII output pins if further tuning is required. POWER AND GROUND PLANES From a PCB layout point of view, it is important to place the decoupling capacitors as close as possible to the power and GND pins to minimize the inductance. Magnetics Module Grounding A split ground plane under the transformer minimizes noise cou- pling across the transformer and between adjacent coils within. Ensure a physical separation of the ground planes underneath the transformer. Make the width of this separation at least 100 mil. RJ45 Module Grounding For optimal EMC performance, it is recommended to use a metal shielded RJ45 connector with the shield connected to chassis ground. There must be an isolation gap between the chassis ground and the PHY IC ground with consistent isolation across all layers. |
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