TDA4VEN...Q1 datasheet(6/236 Pages) TI

6 / 236 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 3

3 Description.......................................................................3

3.1 Functional Block Diagram........................................... 4

4 Device Comparison......................................................... 6

5 Terminal Configuration and Functions..........................8

5.1 Pin Diagrams.............................................................. 8

5.2 Pin Attributes...............................................................9

5.3 Signal Descriptions................................................... 47

5.4 Pin Connectivity Requirements.................................78

6 Specifications................................................................ 81

6.1 Absolute Maximum Ratings...................................... 81

6.2 ESD Ratings for AEC - Q100 Qualified Devices

in the AMW Package...................................................83

6.3 Power-On Hours (POH)............................................ 83

6.4 Recommended Operating Conditions.......................84

6.5 Operating Performance Points..................................86

6.6 Electrical Characteristics...........................................87

6.7 VPP Specifications for One-Time Programmable

(OTP) eFuses..............................................................92

6.8 Thermal Resistance Characteristics......................... 93

6.9 Timing and Switching Characteristics....................... 94

7 Detailed Description....................................................214

7.1 Overview................................................................. 214

8 Applications, Implementation, and Layout............... 215

8.1 Device Connection and Layout Fundamentals....... 215

8.2 Peripheral- and Interface-Specific Design

Information................................................................ 216

8.3 Clock Routing Guidelines........................................223

9 Device and Documentation Support..........................224

9.1 Device Nomenclature..............................................224

9.2 Tools and Software................................................. 227

9.3 Documentation Support.......................................... 227

9.4 Support Resources................................................. 227

9.5 Trademarks.............................................................227

9.6 Electrostatic Discharge Caution..............................228

9.7 Glossary..................................................................228

10 Revision History........................................................ 228

11 Mechanical, Packaging, and Orderable

Information.................................................................. 230

11.1 Packaging Information.......................................... 230

4 Device Comparison

Table 4-1 shows a comparison between devices, highlighting the differences.

Note

Availability of features listed in this table are a function of shared IO pins, where IO signals associated

with many of the features are multiplexed to a limited number of pins. The SysConfig tool should

be used to assign signal functions to pins. This will provide a better understanding of limitations

associated with pin multiplexing.

Note

To understand what device features are currently supported by TI Software Development Kits (SDKs),

see the PROCESSOR-SDK-J722S Software Build Sheet.

Table 4-1. Device Comparison

FEATURES(1)

REFERENCE

NAME

TDA4VEN8

TDA4AEN8

PROCESSORS AND ACCELERATORS

Speed Grades (See Device Speed Grades)

J, K

Arm Cortex-A53

Microprocessor Subsystem

Arm A53

Quad Core

Arm Cortex-R5F in MCU domain

MCU_R5F

Single Core

Arm Cortex-R5F in MAIN domain

R5FSS0

Single Core

Device Management Subsystem

WKUP_R5F

Single Core

Hardware Security Module

HSM

Yes

Crypto Accelerators

Security

Yes

C7x Floating Point, Vector DSP

C7x256V DSP

Dual Core

Deep Learning Accelerator

MMA

Dual Core

Graphics Processing Unit

GPU

Yes

Video Encoder / Decoder

VENC/VDEC

Yes

Motion JPEG Encoder

JPEG

Yes

Depth and Motion Processing Accelerators

DMPAC

Yes

TDA4VEN-Q1, TDA4AEN-Q1

SPRSP96A – MARCH 2024 – REVISED SEPTEMBER 2024

www.ti.com

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Product Folder Links: TDA4VEN-Q1 TDA4AEN-Q1

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