(3)

VOFFSET supply transients must fall within the specified max voltages.

(4)

To prevent excess current, the supply voltage delta |VDDI – VDD| must be less than the specified limit.

(5)

To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than the specified limit.

(6)

To prevent excess current, the supply voltage delta |VBIAS – VRESET| must be less than the specified limit.

(7)

LS_CLK must run as specified to ensure internal DMD timing for reset waveform commands.

(8)

Refer to the SubLVDS timing requirements in Timing Requirements.

(9)

Simultaneous exposure of the DMD to the maximum Recommended Operating Conditions for temperature and UV illumination

reduces device lifetime.

(10) The array temperature cannot be measured directly and must be computed analytically from the temperature measured at test point

(TP1) shown in Figure 6-2 and the package thermal resistance using the Micromirror Array Temperature Calculation

(11) Long-term is defined as the usable life of the device.

(12) Per Figure 5-1, the maximum operational array temperature is derated based on the micromirror landed duty cycle that the DMD

experiences in the end application. See Micromirror Landed-on/Landed-off Duty cycle for a definition of micromirror landed duty cycle.

(13) The average over time (including storage and operating) is that the device is not in the elevated dew point temperature range.

(14) Exposure to dew point temperatures in the elevated range during storage and operation is limited to less than a total cumulative time of

CTELR.

(15) Applies to the region defined in Figure 5-2

(16) The active area of the DMD is surrounded by an aperture on the inside of the DMD window surface that masks structures of the

DMD device assembly for normal view. The aperture is sized to anticipate several optical conditions. Overfill light illuminating the area

outside the active array can scatter and create adverse effects on the performance of an end application using the DMD. Minimizing

the light flux incident outside the active array is a design requirement of the illumination optical system. Depending on the particular

optical architecture and assembly tolerances of the optical system, the amount of overfill light on the outside of the active array may

cause system performance degradation.

(17) To calculate, see Window Aperture Illumination Overfill Calculation.

(18) The maximum allowable optical power incident on the DMD is limited by the maximum optical power density for each wavelength

range specified and the micromirror array temperature (TARRAY).

(19) To calculate, see Micromirror Power Density Calculation.

0/100

100/0

30

5/95

95/5

40

50

60

70

80

10/90

90/10

15/85

85/15

20/80

80/20

25/75

75/25

30/70

70/30

35/65

65/35

40/60

60/40

45/55

55/45

50/50

50/50

Micromirror Landed Duty Cycle

Figure 5-1. Maximum Recommended Array Temperature—Derating Curve

www.ti.com

DLP391TP

DLPS289A – JUNE 2025 – REVISED SEPTEMBER 2025

Copyright © 2025 Texas Instruments Incorporated

Submit Document Feedback

9

Product Folder Links: DLP391TP