5.5 Thermal Information

THERMAL METRIC

DLP391TP

UNIT

FSB

154 PIN

THERMAL INFORMATION

Thermal Resistance(1)

2.3

°C/W

(1)

The DMD is designed to conduct absorbed and dissipated heat to the back of the package. The cooling system must be capable of

maintaining the DMD within the temperature range specified in the Recommended Operating Conditions. The total heat load on the

DMD is largely driven by the incident light absorbed by the active area; although other contributions include light energy absorbed by

the window aperture and electrical power dissipation of the array. Optical systems should be designed to minimize the light energy

falling outside the window clear aperture since any additional thermal load in this area can significantly degrade the reliability of the

device.

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DLP391TP

DLPS289A – JUNE 2025 – REVISED SEPTEMBER 2025

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