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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LMKDB1104FS Scheda tecnica(PDF) 83 Page - Texas Instruments |
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LMKDB1104FS Scheda tecnica(HTML) 83 Page - Texas Instruments |
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83 / 95 page  www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN 0.05 MAX 80X ( 0.25) (0.5) TYP (0.5) TYP ( 0.25) SOLDER MASK OPENING ( 0.25) METAL ( 2.8) ( 0.2) VIA TYP (1.15) (1.15) 4224877/A 03/2019 TLGA - 0.9 mm max height NPP0080A THIN LAND GRID ARRAY NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM C 1 2 3 4 5 6 7 8 9 10 11 12 A B D E F G H J K L M LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 15X NON-SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL SOLDER MASK OPENING SOLDER MASK DEFINED METAL UNDER SOLDER MASK EXPOSED METAL |
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