LMKDB1104FS datasheet(93/95 Pages) TI2

Il numero della parte	LMKDB1104FS

Spiegazioni elettronici	LMKDB11xx PCIe Gen 1 to Gen 7 Ultra Low Jitter LP-HCSL Clock Buffer Family

PDF	95 Pages

Scroll/Zoom	100%

Produttore elettronici	TI2 [Texas Instruments]

Homepage	https://www.ti.com

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93 / 95 page

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EXAMPLE BOARD LAYOUT

24X (0.4)

(1.05)

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

28X (0.6)

28X (0.2)

(3.8)

(

2.6)

(

0.2) TYP

VIA

VQFN - 1 mm max height

REX0028A

PLASTIC QUAD FLATPACK - NO LEAD

4229744/B 07/2025

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

SEE SOLDER MASK

DETAIL

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS

LMKDB1104FS Scheda tecnica(PDF) 93 Page - Texas Instruments

LMKDB1104FS Scheda tecnica(HTML) 93 Page - Texas Instruments

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