UCS1003-2 datasheet(5/138 Pages) MICROCHIP

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DS20005346B-page 5

UCS1003-1/2/3

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Voltage on VDD, VS and VBUS Pins....................................................................................................................-0.3 to 6V

Pull-up Voltage (VPULLUP) .................................................................................................................... -0.3 to VDD + 0.3V

Data Switch Current (IHSW_ON), Switch On...........................................................................................................±50 mA

Port Power Switch Current .................................................................................................................... Internally Limited

Data Switch Pin Voltage To Ground (DPOUT, DPIN, DMOUT, DMIN); (VDD powered or unpowered)....... -0.3 to VDD +0.3V

Differential Voltage Across Open Data Switch (DPOUT – DPIN, DMOUT – DMIN, DPIN – DPOUT, DMIN – DMOUT) .........VDD

Voltage on any Other Pin to Ground ................................................................................................... -0.3 to VDD + 0.3V

Current on any Other Pin ......................................................................................................................................±10 mA

Package Power Dissipation ............................................................................................................................... Table 1-1

Operating Ambient Temperature Range .....................................................................................................-40 to +125°C

Storage Temperature Range.......................................................................................................................-55 to +150°C

† Notice:

Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This

is a stress rating only and functional operation of the device at those or any other conditions above those indicated in

the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

TABLE 1-1:

POWER DISSIPATION SUMMARY

Board

Package



Derating

Factor Above

+25°C

TA <+25°C

Power

Rating

TA <+70°C

Power

Rating

TA < +85°C

Power

Rating

High K

(see Note 1)

20-pin QFN

4x 4 mm

6°C/W

41°C/W

24.4 mW°/C

2193 mW

1095 mW

729 mW

Low K

(see Note 1)

20-pin QFN

4x 4 mm

6°C/W

60°C/W

16.67 mW°/C

1498 mW

748 mW

498 mW

Note 1:

Junction to ambient (

JA) is dependent on the design of the thermal vias. A High K board uses a thermal

via design with a thermal landing soldered to the PCB ground plane, with 0.3 mm (12 mil) diameter vias in

a 3x3 matrix (9 total) at 0.5 mm (20 mil) pitch. The board is multilayer with 1-ounce internal power and

ground planes and 2-ounce copper traces on top and bottom. A Low K board is a two-layer board without

thermal via design, with 2-ounce copper traces on the top and bottom.

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