ADL6317ACCZ-R7 datasheet(6/38 Pages) AD

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ADL6317

Data Sheet

Rev. B | Page 6 of 38

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

V50AMP1, V50AMP2

−0.3 V to +5.5V

V33FUSE

−0.3 V to +3.6 V

VDAC

−0.3 V to +3.6 V

VVA_ANALOG

−0.3 V to +3.6 V

CS, SCLK, SDI, SDO, CS4, CS5, TXEN

−0.3 V to +3.6 V

RF Input Power (IN_N, IN_P) at 50 Ω

10 dBm

Operating Temperature Range

(Measured at Exposed Pad)

−40°C to +105°C

Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the natural convection junction to ambient thermal

resistance measured in a one cubic foot sealed enclosure. θJC is

the conduction thermal resistance from junction to case where

the case temperature is measured at the bottom of the package.

The thermal resistance values specified in Table 5 are simulated

based on JEDEC specifications (unless specified otherwise) and

should be used in compliance with JESD51-12.

Table 5. Thermal Resistance1,2

Package Type

θJA

θJC BOTTOM

Unit

CC-38-1

21.4

7.6

°C/W

For θJC BOTTOM, the case bottom is controlled at105°C and the case top is

controlled at 100°C.

Using enhanced heat removal (for example, PCB, heat sink, and airflow)

techniques to improve thermal resistance values.

ESD CAUTION

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