ADL6317ACCZ-R7 datasheet(22/38 Pages) AD

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ADL6317

Data Sheet

Rev. B | Page 22 of 38

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–100

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–30

–20

–10

CENTER 1.85GHz

#RES BW 30kHz

SPAN 24.52MHz

SWEEP 103.9ms

VBW 30kHz

Figure 44. LTE Carrier, Adjacent and Alternate CPR at 1850 MHz,

VVA Attenuation = 0 dB, DSA Attenuation = 11 dB, PIN = −17.2 dBm

–90

–80

–70

–60

–50

–40

–30

–6

–4

–2

OUTPUT POWER (dBm)

ADJACENT CPR

ALTERNATE CPR

Figure 45. Adjacent and Alternate Channel Power Ratio vs. Output Power

(POUT) by PIN at 1850 MHz, LTE Test Model 1.1 (TM1.1), VVA Attenuation = 0 dB,

DSA Attenuation = 0 dB

–90

–80

–70

–60

–50

–40

–30

–6

–4

–2

OUTPUT POWER (dBm)

ADJACENT CPR

ALTERNATE CPR

Figure 46. Adjacent and Alternate Channel Power Ratio vs. Output Power

(POUT) by VVA Attenuation at 1850 MHz, LTE TM1.1, PIN = −17.2 dBm, DSA

Attenuation = 0 dB

–90

–80

–70

–60

–50

–40

–30

–2

OUTPUT POWER (dBm)

ADJACENT CPR

ALTERNATE CPR

Figure 47. Adjacent and Alternate Channel Power Ratio vs. Output Power

(POUT) by DSA Attenuation at 1850 MHz, LTE TM1.1, PIN = −17.2 dBm,

VVA Attenuation = 0 dB

LAYOUT

Solder the exposed pad on the underside of the ADL6317 to a

low thermal and electrical impedance ground plane. This pad is

typically soldered to an exposed opening in the solder mask on

the evaluation board. Notice the use of 19 via holes on the exposed

pad of the ADL6317-EVALZ evaluation board. Connect these

ground vias to all other ground layers on the evaluation board to

maximize heat dissipation from the device package. For more

information on the ADL6317-EVALZ evaluation board,

contact Analog Devices, Inc.

Ensure that the decoupling capacitors are located close to the

supply voltage pins.

Figure 48. Evaluation Board Layout for the ADL6317-EVALZ

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