CC2640R2FYFVT.B datasheet(17/74 Pages) TI2

17 / 74 page

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX UNIT

Supply voltage (VDDS, VDDS2,

and VDDS3)

VDDR supplied by internal DC/DC regulator or

internal GLDO. VDDS_DCDC connected to VDDS

on PCB

–0.3

4.1

Supply voltage (VDDS(3) and

VDDR)

External regulator mode (VDDS and VDDR pins

connected on PCB)

–0.3

2.25

Voltage on any digital pin(4) (5)

–0.3

VDDSx + 0.3, max 4.1

Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P

–0.3

VDDR + 0.3, max 2.25

Voltage on ADC input (Vin)

Voltage scaling enabled

–0.3

VDDS

Voltage scaling disabled, internal reference

–0.3

1.49

Voltage scaling disabled, VDDS as reference

–0.3

VDDS / 2.9

Input RF level

5 dBm

Tstg

Storage temperature

–40

150

°C

(1)

All voltage values are with respect to ground, unless otherwise noted.

(2)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3)

In external regulator mode, VDDS2 and VDDS3 must be at the same potential as VDDS.

(4)

Including analog-capable DIO.

(5)

Each pin is referenced to a specific VDDSx (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see Table 9-3 .

8.2 ESD Ratings

VALUE

UNIT

VESD

Electrostatic discharge

...

RSM, RHB, and RGZ packages

Human body model (HBM), per ANSI/ESDA/

JEDEC JS001(1)

All pins

±2500

Charged device model (CDM), per JESD22-

C101(2)

RF pins

±500

Non-RF pins

±500

VESD

Electrostatic discharge

...

YFV package

Human body model (HBM), per ANSI/ESDA/

JEDEC JS001(1)

All pins

±1500

Charged device model (CDM), per JESD22-

C101(2)

RF pins

±500

Non-RF pins

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

www.ti.com

CC2640R2F

SWRS204C – DECEMBER 2016 – REVISED SEPTEMBER 2020

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